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Notebook CPU Package Description
In the traditional sense of the package for the chip is just a shell, is a mechanical structural protection; but in the current structural characteristics of the chip package, in addition, it also contains a cooling mechanism, and became the electrical properties of the chip and the motherboard connected platform. Furthermore, the complexity of the package depends largely on the structure of chip features and design methods. This complexity of the CPU chips in terms of its packaging technology more complex. As the package is about the maximum protection of CPU to play its best performance and provide a platform to connect with the motherboard, so the performance and structure of the package is to achieve small size notebook-specific CPU, heat quickly, the characteristics of low power consumption guarantee.
CPU high-speed development, the size of laptops, heat and function restriction is undoubtedly a challenge. As a notebook dedicated CPU, in order to meet these requirements, the only thing to do from the package, the article has. In general, what kind of package used often depends on CPU each era of technology and cost factors. For laptops, because of its compact structure, small space, so it directly affects the size of the thickness of laptops and space utilization; its cooling effect of a direct impact on the stability of the machine is running; it will affect the power consumption of laptop battery life. These technical indicators used by CPU and laptops is closely related to the package, so packaging technology for laptops dedicated CPU is concerned, is a very important technology embodied, which is addressed in our notebooks CPU(Dell inspiron 1720 battery) upgrade, you must First, consider the packaging of the problem.
Like with the desktop computer, notebook-specific CPU-packaged forms of CPU due to the different generations and different. Here are some common CPU-laptop-specific packages for upgrade information. (Who introduced the Pentium MMX will start again before the 386 and 486 levels of Mobile CPU upgrade now has no meaning, it is no longer introduced. Part of the TM using the AMD mobile CPU and a small number of products, it is not in this article within the scope of discussion)
TCP (Tape Carrier Package): thin-film encapsulation TCP technology, mainly used on the INTEL Mobile Pentium MMX. TCP packaging technology using heat as opposed to CPU-time regular PGA pin array type CPU is much smaller, used in notebook computers can reduce the volume of additional cooling devices to improve the space utilization of the host, so common in a number of super - thin and light laptop. However, as TCP package is soldered directly to the CPU on the motherboard, so ordinary users can not be replaced. In this writer's give a brief introduction.
MMC (Mobile Module Connector): MMX era of mid-and late, Intel introduced a modular package, IMM (Intel Mobile Module) for laptops dedicated CPU, which is mentioned here MMC package form. Using this package is actually a CPU, including CPU, including board, which consists of CPU core, chipset North Bridge chip, voltage conversion components and systems to maintain the temperature detector composed of the bus. MMC is a modular pluggable package, using two special interfaces connect with the motherboard. Has the advantage of using MMC package because it integrates the Northbridge on the motherboard, allowing motherboard designs are being simplified to reduce costs.
MMC1: MMC1 package module CPU is Intel notebook-specific CPU times from MMX to Pentium II era of transition products, Intel in April 1998 launched the first notebook dedicated Pentium ? CPU is used in this package, and MMC similar, MMC1 also contains a CPU, including circuit boards, circuit boards difference is MMC1 also includes Pentium II's second-level cache (L2-Cache), and the module integrated into the 440BX chipset North Bridge chipset Northbridge. According to the internal 440BX chipset Northbridge different, MMC1 divided into two kinds of AGP SET and PCI SET. The latter does not support AGP graphics cards but can only use PCI graphics cards. Also worth mentioning is that, MMC1 packaged CPU is also connected through the two slots and the motherboard, a total of 280 pins.
MMC1 package positive, have been removed on the CPU and north bridge chipset heat sink
MMC1 package on the back, the left two white slots to connect the interface with the motherboard
MMC2: laptop graphics card has lagged behind desktop computers, although individual graphics chip maker has developed a slight 3D effect of notebook-use graphics chip, but the lack of CPU support, display effect is still unsatisfactory. To this end, Intel launched in late 1998 to increase the AGP functional laptop CPU. This CPU is still modular, encapsulated in the form of MMC2. MMC2 structure and MMC1 similar to, but MMC2 interface with the motherboard a total of 400 feet for a pin, unlike MMC1 a total of two 280-pin socket. This package forms of CPU most prominent feature is the addition of support for AGP, allowing notebook PC features with the 3D periodic leap. But precisely because of this feature with this CPU-heat relative to teach more, it needs to heat sink, fan and other cooling devices and adopted a set of rigorous thermal design can achieve the cooling requirements. CPU package using MMC2 more common in some performance-oriented all-in laptops.
MMC2 package positive, with MMC1 similar radiator for the CPU and North Bridge respectively, the following
MMC2 back of the package, the left connecting with the motherboard slot, a total of 400 pins
Mini-cartridge: This is a very "short-lived," the package, only in Mobile Pentium II CPU part of the models appeared. And the MMC package different is that it does not have an integrated chipset North Bridge, the external metal shell was surrounded by only exposed a core part of the Mobile CPU for the vendor install radiator on the back with a similar MMC2 package, there is a plug connected to the motherboard needle, pin count of 240.
Mini-cartridge package CPU positive
Mini-cartridge package and CPU on the back left side of the pin on the motherboard connection
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BGA (Ball Grid Array): "Ball Grid Array"
?PGA (Micro Pin Grid Array): needle-grid array
The past, introduced the notebook(Dell inspiron 630m battery) CPU's article, BGA, and ?PGA are often discussed together, because in essence is the internal ?PGA or BGA. (?PGA forms of processors can be said to combine with the SOCKET type BGA processors advantages generated). ?PGA packaged in a BGA package only on the basis of an increase of an adapter plate (interposer). Note that this adapter plate is different from the MMC package circuit board, its role is to the bottom of the BGA package draws directly from the CPU core of the solder ball pin can be directly inserted into the motherboard pin ZIF socket, which would convert into ?PGA package. Usually, BGA package, a one-time CPU is soldered onto the motherboard can not be upgraded. CPU package, due to the ?PGA and desktop CPU using a similar method-swappable, so the potential to escalate very large (in the following presentation I will detail below)
The general said that more use of BGA-1 or ?PGA-1 package CPU, specifically what is the difference between the solder balls of their feet or the back of the pin.
BGA -1 and ?PGA-1 (Micro-PGA-1): In a sense, BGA-1 and ?PGA-1 package types, Mobile CPU is our understanding of the CPU, these two packages so that she returned to CPU to a single chip package. In both packages, the entire CPU core part of the (Die) is soldered directly to the substrate, from the figure we can see, CPU is located in the core of the center of the substrate. This package approach is also a manifestation of technological progress, represents the beginning of another packaging technology. Relative to the CPU in terms of MMC packages, BGA-1 and ?PGA-1's great advantage is its ultra-thin features, can be seen from the figure, using these two packages very small size of the CPU, and the former also can be directly welded on the motherboard, so a number of ultra-thin laptops to meet the design requirements, to reduce the thickness of notebook body played an important role. In particular, starting from the Mobile Pentium III, with a light laptop, thin in vogue, these two CPU package will undoubtedly provide an excellent solution.
BGA-1 package CPU positive
BGA-1 package CPU on the back, pay attention to the figure as "solder ball feet"
BGA-2 and ?PGA-2 (Micro-PGA-2)
BGA2 and ?PGA2 is the Pentium III product of the times, in other words, BGA-2 and ?PGA-2 only in the Mobile Pentium III after the CPU in the application so we can easily determine a CPU package, the form used in BGA-1 , or ?PGA-1, or BGA-2 or ?PGA-2's. Distinction between them is "exposed" on the substrate of the Die, Die is a Pentium III, then the piece of CPU used in packaging in the form of BGA-2 or ?PGA-2. In addition, because BGA-2 package, Mobile Pentium III CPU uses a 0.18-micron manufacturing process, so in terms of the relative BGA-1 package, BGA-2 package, the kernel smaller, was square. The kernel package, BGA-1 large rectangular.
?PGA-2 package CPU front, Die for the square and the volume compared with ?PGA-1 small
?PGA-2 package and CPU on the back, pay attention to the figure shows the pin instead of the solder ball BGA-2 feet
Micro-FCPGA (micro Flip Chip Plastic Grid Array) and Micro-FCBGA (Micro Flip Chip Ball Grid Array)
From the structural design point of view, these two packages are attached to BGA and ?PGA packaging, and the BGA-1 and ?PGA-1, as well as the BGA-2 and ?PGA-2 are very similar.
Micro-FCPGA Chinese called "micro-chips down the plastic grid array", which means the processor package substrate that contains a down installation, the chip package by epoxy materials, the use of 2.03 mm long and 0.32 mm in diameter 478 pin motherboard processor socket contacts. It is with the Micro-PGA package, the difference is that, micro-FCPGA does not interpolation type substrate, while in the bottom of the capacitors are installed for the anti-interference.
Micro-FCPGA package diagram, the processor on the back for the pin, and installed anti-interference capacitor used in
Micro-FCBGA Chinese called "micro-flip chip ball grid array", the package includes a face surface of the board, by the epoxy material packaged chips. And Micro-FCPGA different is that it uses a bottom 479 of the 0.78 mm diameter solder ball feet connect with the motherboard and another for the anti-interference capacitor installed on the CPU front, rather than the back (pictured)
Micro-FCBGA package diagram, the processor on the back foot for the solder ball, positive for anti-interference capacitor installed
Micro-FCPGA and Micro-FCBGA(Dell inspiron 6400 battery) is the most mature and most widely used packages, one of the Pentium III-M, Pentium IV-M, as well as the latest Intel Centrino platform, Pentium-M can be seen in its presence. Represents the current notebook-specific CPU packaging technology, the highest level.
All times are listed below the main application of notebook-specific CPU package in order to upgrade reference.
1. Pentium and Pentium-MMX: TCP, MMC1.
2. Pentium II: MMC1, MMC2, BGA-1, ?PGA-1, Mini-cartridge.
3. Pentium III: MMC2, BGA-2, ?PGA-2.
4. Pentium III-M, Pentium IV-M, Pentium-M: Micro-FCPGA, Micro-FCBGA.
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home building.?
i am looking for an engineering student or architect student or anyone that is knowlegeable in home building. i want to know how do you i go about building a home that has 3 bedrooms 2 and one half bath with garage for as little as possible brand new. please give me some numbers as to how much it may be. with all of the lighter and stronger materials outthere what is a way to get that done. how about a geodesic dome home. i live in tampa bay florida and i hear those withstand hurricanes well cause they are round so the wind goes around them. this home does not need to have sinks, tub, shower, cabinets or stoves or fridge. i will decide where to buy those later. just interested in foundation, walls, roof, or removeable-sliding walls to seperate the rooms. like to use solar and wind for power. of course i will still be on the electric grid but as little as possible. i am sitting at davis island beach and the idea just came to me. lets see what good ole american enginuity can do. thanks.
I don't know about the rest, but here is a list of dome sites on Yahoo:
http://groups.yahoo.com/group/Dome_Living/
http://groups.yahoo.com/group/Decahome/
http://groups.yahoo.com/group/domelist/
http://finance.groups.yahoo.com/group/Domes/
http://groups.yahoo.com/group/MissouriDome/
http://groups.yahoo.com/group/GeodesicDomeHomes/
Any if not all of these sites can help you with your questions about geodesics.
But it seems to me the cheapest way to build is with SIPs, Structural Insulated Panels. They can be made for any floor pland and a super-insulated house can be enclosed within a couple of days.
But then again the more you do yourself the more you'll save and the domes with the hub systems are basically a cut and bolt for the frame and then nail the sheathing (yeah I know it's more complicated but it's still a good representation).
Hope that helps
DK
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